9/28/2023 0 Comments Power email address extractorA full EV power electronics electrothermal workflow provides solutions from power IC, to package, to board with Ansys SIwave-CPA for signal integrity, power integrity, and EMI analysis, and the Ansys Q3D Extractor parasitic extraction tool. ![]() Specific industry sectors like healthcare, automotive, and aerospace also benefit from Ansys digital engineering workflows in 2023 R2. New, integrated features in 2023 R2 enable engineers to efficiently meet high-tech challenges amid increasingly complex product requirements. ![]() Additionally, Ansys EMC Plus (formerly Ansys EMA3D Cable) now offers a full electromagnetic compatibility (EMC) workflow. A complete EM simulation and modeling chain for IC design integrates the Ansys High Frequency Structure Simulator ( HFSS), Ansys® Q3D Extractor® parasitic extraction analysis, and the Ansys® RaptorX™ EM solver. The latest updates to Ansys® RedHawk-SC™, a multiphysics sign-off solution for semiconductors, significantly accelerate thermal analysis workflows. All major semiconductor foundries have certified Ansys solutions for their most advanced technology nodes, and Ansys electrothermal solutions are essential to reliable 3D-IC design. Innovations like high-density 3D-ICs enable product development teams to pack more features in a smaller space, but those compact form factors complicate thermal, electromagnetic (EM), and power challenges. These products depend on new semiconductor and integrated circuit (IC) technologies and advanced electronic capabilities. Industries Innovate and Collaborate with Digital EngineeringĪdvanced electronics are critical to next-gen product designs like electric vehicles (EVs), vertical takeoff and landing aircraft, and life-saving medical devices.
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